evaporation materials

Thin Film Sputtering Composition Measure

Thin Film Sputtering Composition Technique in the Sputtering Process

Thin Film SputteringSecondary Ion Mass Spectrometry (SIMS) is a Thin Film Sputtering technique. Used in materials, this science studies the composition of thin films and solid surfaces. Implemented by using the sputtering the sample’s surface with a focused primary ion beam.

In recent years, there has been an increasing interest in studying dopants and contaminants in thin layers near surface in samples. This is due to device structures get smaller and smaller.

SIMS can be used for examining the elementary composition of the surface as well as near surface region of samples. Measured sensitivity is down to parts per billion. In order to get the maximum performance from the device, atmospheric contaminants with low atomic weight such as and oxygen (O), carbon (C), and hydrogen (H) should have low concentration levels.

SIMS: A High Sensitivity Surface Analysis Technique

In SIMS analysis, contamination of hydrocarbons on the surface of the sample to be assessed may produce incorrect results. Hydrocarbons exist abundantly in ambient atmosphere. Therefore, these often deposit on the surface of samples when exposed to air.

During SIMS analysis, the atmospheric contamination on the surface can be embedded into the sample by means of a primary ion beam. Consequently, this contamination leads to distorted or spurious profiles. Therefore, it is very important for operators to know whether they are determining the surface’s composition, or just viewing an artifact caused by contamination.


Got specific requirements or Questions about sputtering targets, evaporation material, crucible liners, metal foil, sheet, plate, or rod and wire? The technical staff at KAMIS is ready to provide expert knowledge to assist you with your project.

Contact KAMIS today at 845-628-6173 or click the blue button below for quick answers and attention from our knowledgeable staff.

KAMIS prides itself on consistently providing high quality materials and dependable service. We stand behind every product we deliver. If you are ever unsatisfied with your material, contact KAMIS for a full replacement or refund.

Kamis Inc

The entire support staff and sales engineers at KAMIS are always available during business hours to answer your technical questions and offer guidance on your projects.

Our expertise and commitment to supplying high quality products and service has enabled KAMIS to earn thousands of satisfied customers around the world.

evaporation materials

Sputtering Target Bonding Preferred Method

Sputtering Target Bonding Methods

Sputtering Target BondingMetallic bonding delivers excellent thermal conductivity and is recommended for most sputtering target bonding applications.

The most effective metallic bonding is with indium and is the preferred Kamis sputtering target bonding method. Kamis uses only high purity indium for the majority of its bonding, to ensure the strongest bond between a sputtering target and a backing plate. Indium also offers enhanced elasticity to accommodate any expansion of the target when in use.

Another advantage of bonding sputtering targets is continued use if cracking occurs during thermal shock. Without bonding to a backing plate, a crack in a sputtering target is considered unusable.

Hot pressed targets are one of the best candidates for bonding; however Kamis can bond almost any type of sputtering target to a backing plate. If you are unsure if your sputtering target should be bonded, feel free to contact us for specific advice about your target and sputtering system requirements.

Most sputtering targets are bonded to copper backing plates or copper sheet, as this material offers enhanced thermal conductivity. Kamis also offers other sputtering target backing plate options including stainless steel, molybdenum and aluminum.

Additionally, Kamis stocks numerous sputtering targets and backing plates in a wide variety of sizes and purities to work with multiple sputtering systems. Kamis also offers custom alloys and composites manufactured to your sputtering target specifications.

Kamis can bond a sputtering target to a new backing plate or to your previously used backing plate. Additionally, we have experience in bonding to a variety of backing plates including ones with holes, clips and other variations.

In addition to bonding, Kamis also offers a de-bonding service to remove your spent sputtering target from your backing plate. High purity sputtering targets can be reclaimed when the target is no longer usable for sputtering.

The Kamis sales engineers are available to answer your unique sputtering target questions!


Got specific requirements or Questions about sputtering targets, evaporation material, crucible liners, metal foil, sheet, plate, or rod and wire? The technical staff at KAMIS is ready to provide expert knowledge to assist you with your project.

Contact KAMIS today at 845-628-6173 or click the blue button below for quick answers and attention from our knowledgeable staff.

KAMIS prides itself on consistently providing high quality materials and dependable service. We stand behind every product we deliver. If you are ever unsatisfied with your material, contact KAMIS for a full replacement or refund.

Kamis Inc

The entire support staff and sales engineers at KAMIS are always available during business hours to answer your technical questions and offer guidance on your projects.

Our expertise and commitment to supplying high quality products and service has enabled KAMIS to earn thousands of satisfied customers around the world.