Magnetron sputtering was initially developed using metal or alloy targets with materials having high electrical conductivity (e.g., Al, Ag, Au, Cu, Ti, Mo, etc.). In order to achieve acceptable deposition rates, the target material needed to be electrically and thermally conductive. Ceramic targets were developed for transparent conductive oxides (TCOs) and usually consisted of films […]
Cylindrical rotating magnetrons can provide controlled reactive sputtering on both large areas and high-volume products, while also minimizing arcing and anode problems. Magnetron sputtering, combined with an accurate control of process parameters and layer quality, has become one of the most important methods for depositing thin films. The technique involves bombarding a target surface, which […]
A sputtering target is a material that is used to create thin films in a technique known as sputter deposition, or thin film deposition. During this process the sputtering target material, which begins as a solid, is broken up by gaseous ions into tiny particles that form a spray and coat another material, which is […]
Sputtering targets provide thin-film materials deposited by the sputtering method. Kobelco Research Institute, Inc. started the target material business in 1993 and its competitive strength exists in the approach of originally developing high- performance film-materials before providing the target-materials required to make the films. The research and development group of Kobe Steel is responsible for […]
A sputtering target of platinum-cobalt alloy is disclosed which contains 10 to 55% by weight of platinum; 1 to 15% by weight of a first additional element selected from the group consisting of nickel and tantalum; no more than 1.5% by weight of a second additional element selected from the group consisting of boron, titanium, […]
A target structure is provided for use in a magnetically enhanced diode sputter coating source having a sputtering target which at end-of-life has an eroded surface with a known shape. The sputtering target has a non-sputtered profiled back surface conforming substantially in shape to the eroded surface at end-of-life. A backing plate is bonded to […]
As a result of increased requirements for abrasion resistant and protective thin film coatings, the hardness of thin film coatings has been steadily increasing over the past decade, due primarily to new materials, improved deposition processes and use of nanostructures and nanocomposites. Because it would not be possible to address all these materials, we will […]
Electron beam evaporation is a method of thin film deposition involving the use of an electron beam source, or electron beam gun (EB gun). Both names are commonly used, but the actual device consists of a heated cathode emitting a high flux of electrons which are accelerated by high voltage and focussed into a water […]
Thin film deposition processes play a critical role in the production of high-density, high-performance microelectronic products. Considerable progress has been achieved in the development of deposition processes — and in the development of the reactor systems in which they are carried out. This report discusses the technology trends, products, applications, and suppliers of materials and […]
Thin film material are widely used in various industries for one or more applications. They are used in the encapsulation of photovoltaic solar cell, semiconductor and electrical industry for miniaturization of circuit boards. Their major application is in photovoltaic solar cells, which accounts for a majority of their usage, followed by the MEMS, electrical, semiconductor, […]